Quick turn NPI (New Product Introduction) manufacturing

• In parallel project management coordinates between layout, material procurement, PCB fabrication and manufacturing preparation to ensure all parties are on schedule and one activity does not delay the entire project.
• 1 – 10 day manufacturing turns
• Quantities as low as 1 unit
• On site, off the line prototype validation

Production manufacturing

• “Right fit” manufacturer identified based on product design and product market cycle
• One manufacturing solution from prototype through production
• The ability to qualify and transition the manufacturing to a low cost region / supplier.

System integration

• Backplane assembly
• Cable and harness assembly
• Enclosures
• Integration of hardware and software
• Build to Order (BTO) and Configure to Order (CTO) services Reliability testing
• Functional testing

Process

• Surface Mount Technology (Paste and Epoxy)
• Intrusive Reflow
• Package on Package (PoP)
• Underfill
• Through Hole
• Wave/Selective Wave Soldering
• Press Fit
• Double/Single-Sided Reflow Processing
• Rework and Repairs (Fine Pitch QFP, Area Array Packages)
• Lead-Free Assembly
• Water Soluble and  No-Clean Processes

Packaging

• 01005s, BGA,  uBGA, CCGA
• CSP and Flip Chip
• 0.28mm Fine Pitch Devices
• Mictor Connectors
• Fine Pitch High Pin Count Press Fit Connectors
• Via-in-Pad
• Multi-Layered PC Board (24+ layers)
• Various PCB surface finishes (HASL, ENIG, IS, OSP)